Texas Instruments TPSM8287B30LAPEVM Evaluation Module

Texas Instruments TPSM8287B30LAPEVM Evaluation Module is designed to demonstrate the TPSM8287B30 family of pin-to-pin, step-down, DC/DC power modules with differential remote sensing and I2C interface. The TPSM8287B30LAPEVM delivers up to 30A load current in a pin-to-pin compatible, step-down power module with an I2C interface, frequency synchronization, and remote sense in a 3.75mm × 8mm MagPack™ package. The TI TPSM8287B30LAPEVM supplies an I2C adjustable output voltage, with 0.8% accuracy, between 0.4V and 1.675V, from input voltages from 2.7V to 6V.

Features

  • 30A output current power module with integrated inductor, input capacitors, and output capacitors in a MagPack package
  • Excellent thermal performance (θJA = 8.8°C/W)
  • 3.75mm x 8mm x 2mm power module provides 66mm2 total design size
  • Start-up output voltage adjustable through jumpers to 1 of 16 values
  • Highly accurate output voltage with remote sense and adjustable control loop compensation

Applications

  • FPGA, ASIC, and SoC digital core supply
  • Optical networks
  • Test and measurement equipment
  • Sensors, imaging, and radar

Kit Contents

  • Included
    • TPSM8287B30 PCB (SR087) typical, standalone (not paralleled) application
  • Not Included
    • Order the USB2ANY adapter separately to evaluate the device using TI's TPSM8287B30 EVM GUI

Layout

Location Circuit - Texas Instruments TPSM8287B30LAPEVM Evaluation Module
Publicado: 2025-06-02 | Actualizado: 2025-06-12