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STMicroelectronics BALF-NRF01D3 Ultra Miniature Balun

STMicroelectronics BALF-NRF01D3 Ultra Miniature Balun integrates a matching network in a monolithic glass substrate. The matching impedance for this balun is customized for the nRF51822-QFAAG0/GC/FA, nRF51822-QFABB0, and nRF51422-QFAAE0 RF transceivers. The BALF-NRF01D3 balun uses STMicroelectronics Integrated Passive Device (IPD) technology on a non-conductive glass substrate that optimizes RF performances.

Features

  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated flip-chip on glass
  • <1.5mm2 small footprint
  • 560μm low profile (after reflow)
  • High RF performance
  • PCB space saving versus discrete solution
  • BOM count reduction
  • Efficient manufacturability

Applications

  • 2.45GHz balun with integrated matching network
  • Matching optimized for the following chipsets
    • nRF51822-QFAAG0/GC/FA
    • nRF51822-QFABB0
    • nRF51422-QFAAE0

BALF-NRF01D3 Application Circuit

Application Circuit Diagram - STMicroelectronics BALF-NRF01D3 Ultra Miniature Balun
Publicado: 2019-01-25 | Actualizado: 2024-01-23