SanDisk Western Digital iNAND® AT EU312 EFDs

SanDisk Western Digital iNAND® AT EU312 EFDs (Embedded Flash Drives) are high-performance embedded storage solutions designed for harsh environments and demanding requirements for cockpit applications and Advanced Driver Assistance Systems (ADAS). These include cutting-edge infotainment, navigation, HD mapping, V2V/V2I communication, drive event recorders, and autonomous driving. The UFS 2.1 interface iNAND AT EU312 EFDs deliver high-performance data transmission in even the most extreme environmental conditions, including ambient temperatures ranging from -40°C to +105°C. These devices are AEC-Q100 qualified and are designed to meet the reliability requirements of the automotive industry.

Built with optimized 3D NAND technology and a fast UFS v2.1 interface, the iNAND AT EU312 EFDs offer superior read and write performance, delivering an embedded storage solution for the most data-intensive automotive applications.

Features

UFS 2.1 standard interface embedded flash drive with additional features for automotive applications
16GB, 32GB, 64GB, 128GB, and 256GB capacities, using advanced 3D NAND memory technology
Automotive Grade 3 (-40°C to +85°C) and Grade 2 (-40°C to +105°C) temperature range options
Designed to deliver high-performance data transmission in even the most extreme environmental conditions
Advanced memory management firmware features, including strong ECC, read refresh, wear-leveling, and bad block management
Automotive-specific feature set, including advanced health status monitor, enhanced power failure protection, fast boot, enhanced SLC LUN, and OEM configurable boot partitioning

Optimized for a wide variety of read/write intensive use cases
JEDEC47 and AEC-Q100 compliant
Production Part Approval Process (PPAP) documentation available
Extended PCN and EOL support
Designed for high reliability with low DPPM manufacturing flow
Full vertical integration of design, manufacturing, assembly, test, reliability analysis, and monitoring that supports the entire product life-cycle
Compact 11.5mm x 13.0mm x 1.2mm ball grid array (BGA) package