Pulse Electronics SMD Wire Wound Chip Beads

Pulse Electronics SMD Wire Wound Chip Beads are suitable for filtering, impedance matching, resonance, and choke circuits for RF designers. The chip beads' ceramic body and wire wound construction provides high SRFs and exceptional Q value, even at high frequencies. BWCM series chip beads feature a low DC resistance design that supports low loss, high output, and low power consumption. BWCS series chip beads have a non-magnetic coil form that ensures thermal stability, predictability, and batch consistency. Pulse Electronics SMD Wire Wound Chip Beads are ideal for RF products for cellular phones, GPS receivers, base stations, remote controls, and security systems and other RF modules.