NXP Semiconductors i.MX 8M Mini Applications Processors

NXP Semiconductors i.MX 8M Mini Applications Processors blend advanced processing capabilities with sophisticated audio, video, and graphics to deliver low-power, high-performing solutions for embedded consumer and industrial applications. The i.MX 8M Mini processors are part of NXP’s EdgeVerse™ edge computing platform. The i.MX 8M Mini Processors also offer a wide range of capabilities in terms of system connectivity (PCIe, Gbit Ethernet, SDIO/eMMC, USB 2.0, MIPI-CSI, MIPI-DSI) and memory interface flexibility (LPDDR4, DDR4, DDR3L). This makes these devices extremely applicable to a broad spectrum of non-media-rich general-purpose applications requiring high performance, power-efficient operation, and low system cost.

The i.MX 8M Mini Applications Processors are offered in two families:

i.MX 8M Mini Quad/Dual/Solo, which integrates four, two, or one Arm® Cortex®-A53 Cores, one Cortex-M4F Core, GCNanoUltra 3D GPU, GC320 2D GPU,1080p60 h.265 and VP9 decode, and 1080p60 h.264 and VP8 encode.
i.MX 8M Mini QuadLite/DualLite/SoloLite, which integrates four, two, or one Arm Cortex-A53 cores, one Cortex-M4F core, GCNanoUltra 3D GPU, and GC320 2D GPU.

Devices in both families are qualified to industrial and commercial operating conditions. The i.MX 8M Mini Processors are all based on 14FinFET technology, which improves immunity to alpha particles, reducing memory bit-flips for higher reliability in harsh environments. Built in high-performing and power-efficient 14FinFET technology, the i.MX 8M Mini Applications Processors is the choice for high-performing and cost-effective products in the rapidly evolving smart home and smart embedded industrial market segments.

All of the i.MX 8M Mini Applications Processors feature the same 14mm x 14mm LFBGA485 package, and are pin-compatible for maximum scalability.

Features

Up to 4x Arm Cortex-A53 Core platforms with NEON^™ SIMD and floating-point unit delivers advanced compute performance
- Up to 1.8GHz per core
- 64-bit Armv8-A architecture
- 32KB L1-I Cache / 32KB L1-D Cache
- 512KB L2 Cache
1x Arm Cortex-M4 core platform for low-power system control/standby
- Up to 400MHz
- 16KB L1-I Cache / 16KB L2-D Cache
- 256KB Tightly Coupled Memory (TCM)
On-Chip memory
- On-chip RAM (256KB + 32KB)
- Flexible memory interface enables highest performance and lowest standby power (LPDDR4), or lowest system cost (DDR3L, DDR4)
- 32/16-bit DRAM interfaces: LPDDR4 (up to 1.5 GHz), DDR4-2400, DDR3L-1600
- 8-bit NAND-Flash, including support for Raw MLC/SLC devices, BCH ECC up to 62-bit, and ONFi3.2 compliance
- eMMC 5.1 Flash (2 interfaces), SPI NOR Flash (3 interfaces), FlexSPI with support for XIP
Multimedia
- 1080p60 VP9 Profile 0, 2 (10-bit) decoder, HEVC/H.265 decoder, AVC/H.264 Baseline, Main, High decoder, VP8 decoder
- 1080p60 AVC/H.264 encoder, VP8 encoder
- GCNanoUltra 3D GPU, 1x shader, OpenGL ES 2.0
- GC320 for 2D GPU
- LCDIF Display Controller supports up to 2 layers of overlay, 1080p60
- Display: 1x MIPI DSI (4-lane) with PHY
- Camera: 1x MIPI CSI (4-lane) with PHY
- Audio: Supports over 20 channels of audio subject to I/O limitations. 5 Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP, S/PDIF and DSD interfaces:
  - 1 SAI with 8 Tx and 8 Rx lanes
  - 1 SAI with 4 Tx and 4 Rx lanes
  - 2 SAI with 2 Tx and 2 Rx lanes
  - 1 SAI with 1 Tx and 1 RX lane
- 9-Channel Pulse Density Modulation (PDM) input

Connectivity:
- 1x PCIe 2.0 (1-lane) with L1 low power sub-states
- 2x USB 2.0 OTG controllers with integrated PHY interfaces:
- 3x SDIO3.0 / eMMC5.1 / SDXC / SD4
- 1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE) for low power
- 4x UART, 4x I2C modules, 3x ECSPI modules
Security:
- Resource Domain Controller (RDC) supports four domains and up to eight regions of DDR
- Arm TrustZone (TZ) architecture:
- Support Arm Cortex-A53 MPCore TrustZone
- On-chip RAM (OCRAM) secure region protection using OCRAM controller
- High Assurance Boot (HAB)
- Cryptographic acceleration and assurance (CAAM) module:
  - Support Widevine and PlayReady content protection
  - Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms
  - Real-time integrity checker (RTIC)
  - DRM support for RSA, AES, 3DES, DES
  - Side channel attack resistance
  - True random number generation (RNG)
  - Manufacturing protection support
- Secure non-volatile storage (SNVS):
  - Secure real-time clock (RTC)
- Secure JTAG controller (SJC)
Package
- 485 ball FBGA (Low Profile Fine-pitch Ball Grid Array)
- 14mm x 14mm x 1.25mm; 0.5mm pitch
Qualification:
- Commercial (Tj = 0ºC to +95ºC) and Industrial (-40ºC to +105ºC) products to suit application operating conditions (temperature, product operating lifetime)

Applications

Consumer and Professional Audio Systems
- Portable audio devices
- Wireless or networked speakers
- Surround sound and sound bars
- Audio/video receivers
- Public address systems
Voice Assistance and Machine Vision
- Voice-assisted products
- Factory automation
- Test and measurement
- HMI control assembly line robotics
- Robotic vacuum cleaners
- 3D printers
- Image analytics
- Machine visual inspection

Home and Building Automation
- Video doorbells
- Two-way video conferencing
- HVAC climate control
- Security and surveillance systems
- IoT gateways
Consumer and Healthcare
- Smart appliances
- Cameras and LCDs
- Mobile patient care
- Blood pressure monitor
- Activity and wellness monitor
- Exercise equipment with displays