Infineon Technologies F3L600R10W4S7F_C22 EasyPACK™ IGBT Module
Infineon Technologies F3L600R10W4S7F_C22 EasyPACK™ IGBT Module integrates a 1200V CoolSiC™ Diode, a TRENCHSTOP™ IGBT7, and an NTC temperature sensor into a compact package with PressFIT contact technology. The 1200V CoolSiC Diodes reduce switching losses, and the IGBT7v ensures soft turn-off behavior. This IGBT Module is optimized for solar energy solutions and three-level applications.
The Infineon Technologies F3L600R10W4S7F_C22 EasyPACK IGBT Module features a solder-less, baseplate-less design for a fast, reliable assembly process thanks to PressFIT contact technology.
Features
- 950V collector-emitter voltage (VCES)
- 600A implemented collector current (ICN)
- 800A repetitive peak collector current (ICRM)
- 1200V repetitive peak reverse voltage (VRRM)
- CoolSiC™ Schottky Diode (gen 5)
- TRENCHSTOP IGBT7
- Integrated NTC (negative temperature coefficient) sensor
- -40°C to +150°C temperature under switching conditions (Tvj, op)
- Package with CTI >400
- Solder-less, baseplate-less design
- PressFIT contact technology
Applications
- Motor control designs, boards, and tools
- Solutions for solar energy systems
- Room air conditioners
- Uninterruptible power supply (UPS) systems
- Fast EV charging
- Power transmission and distribution
Related Products
Infineon Technologies Fx3L50R07W2H3FB11 EasyPACK™ IGBT Modules
Designed with fast Trench/Fieldstop High-Speed 3 IGBT and SiC diode and PressFIT/NTC.
Circuit Diagram
Mechanical Drawing (Top, Side)
Mechanical Drawing (Bottom)
Publicado: 2022-07-14
| Actualizado: 2022-07-27