Chip Quik CQB Gold Bonding Wires

Chip Quik CQB Gold Bonding Wires are made of high-purity gold >99.99% and are designed specifically for wire bonding. These bonding wires are stored in a dry, non-corrosive environment and offer excellent electrical conductivity, stability, and resistance to corrosion. The CQB wires are available in 23µm and 25µm diameters. These wires connect electrical components in industries and electrically connect microchip dies to the terminals of a chip package or directly to a substrate. The CQB bonding wires are RoHS 3 compliant, REACH compliant, and conform to J-STD-006C standard. These wires are used by Integrated Circuit (IC) packaging shops, research labs, and advanced manufacturing facilities. The CQB gold bonding wires are ideal for electronics, aerospace, and medicine.