congatec conga-MC1000 COM Express® Mini Module
congatec conga-MC1000 COM Express® Mini Module features a credit-card size design with Intel® Core™ Ultra Series 3 processors and an extended industrial temperature range of -40°C to +85°C. This module offers an ideal upgrade for existing COM Express Type 10-based mission-critical applications, providing up to 180 TOPS of energy-efficient embedded computing performance and up to 32GB of soldered-down LPDDR5x memory for maximum memory bandwidth. The conga-MC1000 uses an Intel Performance Hybrid Architecture with up to 16 cores and Intel Arc™ graphics with up to 12 Xe cores. The conga-MC1000 mini module from congatec delivers high performance for demanding environments in AI-intensive markets.
Features
- Credit-card size
- Suitable for use in environments characterized by extreme temperature fluctuations, weather exposure, vibrations, or continuously demanding operating conditions
- Scalable platform for high-performance embedded and edge systems
- Combines local AI processing, sensor fusion, automation functions, and safety-critical workloads directly at point of deployment with ruggedness and energy efficiency
- Offered as application-ready aReady.COM
- Ideal for both new designs and upgrades of existing systems
Applications
- Mission computers for autonomous and heavy-duty vehicles
- Outdoor edge systems for smart cities
- Energy and renewable sectors
- AI-intensive markets
- Industrial automation
- Robotics
- Medical
- Retail point-of-sales (POS)
- Wayside infrastructure and railways
Specifications
- Intel Performance Hybrid Architecture with up to 16 cores
- Intel Arc graphics with up to 12 Xe cores
- Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
- Up to 32GB LPDDR5x soldered-down memory for maximum memory bandwidth
- Intel Core Ultra Processors Series 3 (Panther Lake-H)
- -40°C to +85°C extended industrial temperature range
Block Diagram
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