+ 125 C Reel Módulos multiprotocolo

Resultados: 21
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Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Modelo ECAD Serie
Frecuencia
Potencia de salida
Tipo de interfaz
Voltaje de alimentación - Mín.
Voltaje de alimentación - Máx.
Temperatura de trabajo mínima
Temperatura de trabajo máxima
Conector de tipo antena
Dimensiones
Protocolo: Bluetooth, BLE - 802.15.1
Protocolo: WiFi - 802.11
Protocolo: ANT, Thread, Zigbee - 802.15.4
Empaquetado
NXP Semiconductors Módulos multiprotocolo IW610GUK/A1ZDI
Hoja de datos
25En existencias
Min.: 1
Mult.: 1
: 2,000

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Silicon Labs Módulos multiprotocolo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Hoja de datos
1,240En existencias
6,000Se espera el 25/12/2026
Min.: 1
Mult.: 1
: 1,000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Módulos multiprotocolo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Hoja de datos
380En existencias
Min.: 1
Mult.: 1
: 1,000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Hoja de datos
2En existencias
Min.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
NXP Semiconductors Módulos multiprotocolo IW610BUK/A1ZDI
Hoja de datos
25En existencias
Min.: 1
Mult.: 1
: 2,000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Módulos multiprotocolo IW610CUK/A1ZDI
Hoja de datos
25En existencias
Min.: 1
Mult.: 1
: 2,000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Silicon Labs Módulos multiprotocolo Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Hoja de datos
2,752En existencias
Min.: 1
Mult.: 1
: 1,000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Módulos multiprotocolo Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Hoja de datos
1,387En existencias
1,000Se espera el 30/10/2026
Min.: 1
Mult.: 1
: 1,000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Murata Electronics Módulos multiprotocolo Shielded Small Wi-Fi 11a/b/g/n/ac/ax 2x2 MIMO + Bluetooth 5.3 Module
Hoja de datos
556En existencias
MouseReel Disponible
Min.: 1
Mult.: 1
: 1,000

2XS 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UAR 1.71 V 3.46 V - 40 C + 125 C 19.2 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
NXP Semiconductors Módulos multiprotocolo IW610FUK/A1ZDI
Hoja de datos
25En existencias
Min.: 1
Mult.: 1
: 2,000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Módulos multiprotocolo IW610FHN/A1ZDI
Hoja de datos
25Se espera el 29/10/2026
Min.: 1
Mult.: 1
: 2,700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Silicon Labs Módulos multiprotocolo Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
Hoja de datos
Plazo de entrega no en existencias 20 Semanas
Min.: 1,000
Mult.: 1,000
: 1,000

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Hoja de datos
Plazo de entrega no en existencias 20 Semanas
Min.: 1,000
Mult.: 1,000
: 1,000

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Hoja de datos
Plazo de entrega no en existencias 20 Semanas
Min.: 1,000
Mult.: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Hoja de datos
Plazo de entrega no en existencias 20 Semanas
Min.: 1,000
Mult.: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Hoja de datos
Plazo de entrega no en existencias 23 Semanas
Min.: 1,000
Mult.: 1,000
: 1,000

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Hoja de datos
Plazo de entrega no en existencias 23 Semanas
Min.: 1,000
Mult.: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Hoja de datos
Plazo de entrega no en existencias 23 Semanas
Min.: 1,000
Mult.: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
NXP Semiconductors Módulos multiprotocolo IW610BHN/A1ZDI
Hoja de datos
Plazo de entrega no en existencias 16 Semanas
Min.: 2,700
Mult.: 2,700
: 2,700

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors Módulos multiprotocolo IW610CHN/A1ZDI
Hoja de datos
Plazo de entrega no en existencias 16 Semanas
Min.: 2,700
Mult.: 2,700
: 2,700

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel
NXP Semiconductors Módulos multiprotocolo IW610GHN/A1ZDI
Hoja de datos
Plazo de entrega no en existencias 16 Semanas
Min.: 1
Mult.: 1
: 2,700

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape