Samtec LPAF Serie Conectores placa a placa y Mezzanine

Resultados: 118
Seleccionar Imagen N.° de pieza Fabricante: Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad. Cantidad RoHS Modelo ECAD Producto Número de posiciones Paso Número de filas Estilo de terminación Ángulo de montaje Altura de pila Régimen de corriente Régimen de voltaje Velocidad de transmisión de datos máxima Temperatura de trabajo mínima Temperatura de trabajo máxima Revestimiento del contacto Material del contacto Material del alojamiento Serie Empaquetado
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 153En existencias
Min.: 1
Mult.: 1
: 500

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 730En existencias
Min.: 1
Mult.: 1
: 500

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 316En existencias
Min.: 1
Mult.: 1
: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 375En existencias
Min.: 1
Mult.: 1
: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 390En existencias
Min.: 1
Mult.: 1
: 500

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 1,473En existencias
Min.: 1
Mult.: 1
: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine 1.27MM LP ARRAY HS HD ARRAY 291En existencias
Min.: 1
Mult.: 1
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 460En existencias
Min.: 1
Mult.: 1
: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 457En existencias
Min.: 1
Mult.: 1
: 550

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 517En existencias
Min.: 1
Mult.: 1
: 550

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 459En existencias
Min.: 1
Mult.: 1
: 550

Sockets 24 Position 1.27 mm (0.05 in) 6 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 439En existencias
Min.: 1
Mult.: 1
: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 75En existencias
Min.: 1
Mult.: 1
: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 35En existencias
Min.: 1
Mult.: 1
: 350

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 9En existencias
325Se espera el 24/08/2026
Min.: 1
Mult.: 1
: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 319En existencias
Min.: 1
Mult.: 1
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
385Se espera el 05/08/2026
Min.: 1
Mult.: 1
: 425

LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
319Se espera el 25/08/2026
Min.: 1
Mult.: 1
: 350

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Plazo de entrega no en existencias 6 Semanas
Min.: 700
Mult.: 700
: 700
LPAF Reel
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Plazo de entrega no en existencias 2 Semanas
Min.: 700
Mult.: 700
: 700

LPAF Reel
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Plazo de entrega no en existencias 6 Semanas
Min.: 700
Mult.: 700
: 700
LPAF Reel
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Plazo de entrega no en existencias 4 Semanas
Min.: 700
Mult.: 700
: 700

LPAF Reel
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Plazo de entrega no en existencias 4 Semanas
Min.: 700
Mult.: 700
: 700

LPAF Reel
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Plazo de entrega no en existencias 4 Semanas
Min.: 475
Mult.: 475
: 475
LPAF Reel
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Plazo de entrega no en existencias 4 Semanas
Min.: 475
Mult.: 475
: 475
LPAF Reel