5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

Resultados: 4,277
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Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Altura de pila
Régimen de corriente
Régimen de voltaje
Velocidad de transmisión de datos máxima
Temperatura de trabajo mínima
Temperatura de trabajo máxima
Revestimiento del contacto
Material del contacto
Material del alojamiento
Serie
Empaquetado
Samtec Conectores placa a placa y Mezzanine Q Strip High-Speed Ground Plane Header
Hoja de datos
145En existencias
Min.: 1
Mult.: 1

Headers 80 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 25 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Conectores placa a placa y Mezzanine 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Hoja de datos
1,707En existencias
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Conectores placa a placa y Mezzanine 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Hoja de datos
265En existencias
Min.: 1
Mult.: 1
Carrete: 300

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 8 mm 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Hoja de datos
705En existencias
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Conectores placa a placa y Mezzanine 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Hoja de datos
195En existencias
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 19 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Conectores placa a placa y Mezzanine 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Hoja de datos
114En existencias
Min.: 1
Mult.: 1

Headers 80 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Conectores placa a placa y Mezzanine 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Hoja de datos
97En existencias
Min.: 1
Mult.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Conectores placa a placa y Mezzanine 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Hoja de datos
291En existencias
Min.: 1
Mult.: 1
Carrete: 300

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
252En existencias
Min.: 1
Mult.: 1
Carrete: 375

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
516En existencias
Min.: 1
Mult.: 1
Carrete: 225

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
266En existencias
Min.: 1
Mult.: 1
Carrete: 325

Sockets 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
187En existencias
Min.: 1
Mult.: 1
Carrete: 375

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
441En existencias
Min.: 1
Mult.: 1
Carrete: 200

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
129En existencias
Min.: 1
Mult.: 1
Carrete: 75

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
613En existencias
Min.: 1
Mult.: 1
Carrete: 225

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
388En existencias
Min.: 1
Mult.: 1
Carrete: 375
Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
247En existencias
MouseReel Disponible
Min.: 1
Mult.: 1
Carrete: 325
No
Sockets 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape, MouseReel
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
370En existencias
Min.: 1
Mult.: 1
Carrete: 200
No
Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
136En existencias
Min.: 1
Mult.: 1
Carrete: 150
No
Headers 560 Position 1.27 mm (0.05 in) 14 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
88En existencias
Min.: 1
Mult.: 1
Carrete: 200
No
Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine
Hoja de datos
278En existencias
Min.: 1
Mult.: 1
Carrete: 350
No
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
200En existencias
Min.: 1
Mult.: 1
Carrete: 250
No
Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
106En existencias
MouseReel Disponible
Min.: 1
Mult.: 1
Carrete: 225
No
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
185En existencias
Min.: 1
Mult.: 1
Carrete: 225
Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
277En existencias
Min.: 1
Mult.: 1
Carrete: 225
Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape