APM6-020-01.5-L-04-2-A-TR

Samtec
200-APM6020015L42ATR
APM6-020-01.5-L-04-2-A-TR

Fabricante:

Descripción:
Conectores placa a placa y Mezzanine 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal

Modelo ECAD:
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Disponibilidad

Existencias:
161 Se puede enviar en 20 días
Mínimo: 1   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$12.69 $12.69
Envase tipo carrete completo (pedir en múltiplos de 600)
$12.69 $7,614.00
$12.12 $14,544.00

Atributo del producto Valor de atributo Seleccionar atributo
Samtec
Categoría de producto: Conectores placa a placa y Mezzanine
RoHS:  
Headers
80 Position
0.635 mm (0.025 in)
4 Row
Solder Balls
Straight
5 mm
1.34 A
155 VAC
56 Gbps
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
APM6
Reel
Cut Tape
Marca: Samtec
Velocidad de transmisión de datos: 56 Gbps
Estilo de montaje: SMD/SMT
Tipo de producto: Board to Board & Mezzanine Connectors
Cantidad de empaque de fábrica: 600
Subcategoría: Board to Board & Mezzanine Connectors
Nombre comercial: Accelerate HP
Productos encontrados:
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Atributos seleccionados: 0

MXHTS:
8536699999
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

56Gbps NRZ High-Speed Board-To-Board Connectors

Samtec 56Gbps Non-Return-to-Zero (NRZ) High-Speed Board-To-Board Connectors majorly include NovaRay® Extreme Performance (EP) and AcceleRate® High-Performance (HP) Arrays connector systems. These connectors are 0.80mm (0.0315") and 0.635mm (0.025") pitch solutions, rated for 56Gbps NRZ applications. The 56Gbps NRZ method is a binary code using low and high signal levels to represent 1/0 information of the digital logic signal. The NRZ system can only transmit 1-bit, such as 0 or 1, of information per signal symbol period. These connectors are well-suited for high-speed applications, including 5G networking, industrial, military/aerospace, test connectivity, medical, broadcast video, automotive, AI/machine learning, and instrumentation.

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

Terminales de alto rendimiento AcceleRate® APF6 y APM6

Los terminales de alto rendimiento AcceleRate® APF6 y APM6 de Samtec son interconexiones de 0.635 mm que cuentan con un rendimiento extremo PAM4 de 12 Gbps y un diseño flexible de pines de campo abierto. Los terminales AcceleRate APF6 y APM6 tienen un diseño de 4 filas de alta densidad, con 10 a 100 posiciones en cada fila. Estos dispositivos son ideales para aplicaciones con espacio limitado, con una altura de 5 mm y un ancho delgado de 5 mm.