LBEE5PA1LD-005

Murata Electronics
81-LBEE5PA1LD-005
LBEE5PA1LD-005

Fabricante:

Descripción:
Módulos multiprotocolo Type 1LD Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.2

Ciclo de vida:
NRND:
No recomendado para nuevos diseños.
Modelo ECAD:
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En existencias: 845

Existencias:
845 Se puede enviar inmediatamente
Plazo de entrega de fábrica:
26 Semanas Tiempo estimado de producción de fábrica para cantidades superiores a las que se muestran.
Mínimo: 1   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$22.41 $22.41
$19.50 $195.00
$18.50 $462.50
$17.12 $1,712.00
$16.29 $4,072.50
$15.72 $7,860.00
Envase tipo carrete completo (pedir en múltiplos de 1000)
$15.09 $15,090.00
2,000 Presupuesto

Atributo del producto Valor de atributo Seleccionar atributo
Murata
Categoría de producto: Módulos multiprotocolo
RoHS:  
1LD
2.4 GHz
17 dBm
GPIO, I2C, SPI, UART
1.8 V
3.6 V
- 40 C
+ 85 C
External
8.9 mm x 7.8 mm x 1.2 mm
Bluetooth 4.2
802.11 a/b/g/n/ac
AWS
Reel
Cut Tape
Marca: Murata Electronics
Velocidad de transmisión de datos: 11 Mb/s, 54 Mb/s, 65 Mb/s
Técnica de modulación: CCK, DSSS, OFDM
Sensibles a la humedad: Yes
Voltaje de alimentación operativo: 3.3 V
Tipo de producto: Multiprotocol Modules
Cantidad de empaque de fábrica: 1000
Subcategoría: Wireless & RF Modules
Alias de las piezas n.º: LBEE5PA1LD-TEMP
Productos encontrados:
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Atributos seleccionados: 0

CNHTS:
8517629990
USHTS:
8517620090
ECCN:
5A992.C

Wireless Modules & Software

Murata Electronics Wireless Modules and Software provide solutions for wearable computing, intelligent homes, smart vehicles, digital health and fitness, machine-to-machine (M2M) commercial, and industrial applications. These complete solutions from Murata that combine sensors, wireless technology, and software to help build infrastructure for the Internet of Things (IoT). Through its wireless connectivity platforms, Murata continuously innovates how to connect and network devices, equipment, and processes to fully achieve IoT. Murata Electronics Wireless Modules and Software are available in a wide variety of connectivity solutions to meet the current and future needs of designers.

Wi-Fi® Modules & Wi-Fi+BLUETOOTH® Modules

Murata Wi-Fi® Modules and Wi-Fi+BLUETOOTH® Modules allow users to connect to the internet directly, providing flexible wireless technology for IoT products. This wide portfolio of Wi-Fi modules supports IEEE 802.11a, 11b, 11g, and 11ac 2x2 MIMO standard, 2.4GHz and 5GHz band for wireless LAN, and Bluetooth 4.1/4.2/5.0/5.1 BR/EDR/LE communication. The interface for the host processor is SDIO or PCIe for high-throughput applications with radio-only modules and UART with MCU-embedded modules for lower data rate applications. The interface for Murata Bluetooth is UART.

Type 1LD Ultra-Small Wi-Fi+BLUETOOTH+MCU Module

Murata Electronics Type 1LD Ultra-Small Wi-Fi®+BLUETOOTH®+MCU Module is based on the Infineon CYW43438 combo chipset and STMicroelectronics STM32F412 MCU. The board supports Wi-Fi 802.11b/g/n + Bluetooth 4.1 up to 96Mbps PHY data rates on Wi-Fi, and a 3Mbps PHY data rate on Bluetooth. The Type 1LD features an integrated 100MHz Arm® Cortex®-M4 MCU for host-side applications and offers an easy-to-design solution for data acquisition, device management, and industrial control applications. Wi-Fi-Bluetooth coexistence, SDIO high-speed bus design, RF matching, antenna design, and regulatory certification has been managed and tested. Each module offers a complete network controller solution. The Wi-Fi, TCP/IP, Bluetooth network stack, security supplicant, and other network application features are hosted directly on the module. Murata Type 1LD module is compact for integration into size- and power-sensitive applications.

Automotive Products for Infotainment

Murata Automotive Products for Infotainment are ideal for In-Vehicle Infotainment (IVI), navigation, and Electronic Throttle Control (ETC). Murata supplies high-reliability electronic components that take advantage of the characteristics of ceramics, such as thermal resistance and vibration resistance. The use of high-frequency technology cultivated by the 3G/4G communication market contributes to the expansion of the Car Navigation and IVI markets and the achievement of the M2M (telematics) system.